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Mochini oa ho Seha Laser oa UV
Mochini oa ho Seha Laser oa UV

Mochini oa ho Seha Laser oa UV

Moetso ona o sebelisa laser e phahameng{{0}, e khuts'oane-ea pulse ultraviolet ho seha FPC (Flexible Printed Circuits) le PCB (Printed Circuit Boards), e nang le bophara ba kerf bo ka tlase ho 30 microns. E hlahisa -marako a mahlakoreng a boreleli a se nang carbonization ho hang, a nang le-tlaase khatello ea mocheso le mocheso o batlang o fokola-sebakeng se amehileng (HAZ).
E entsoe ka ho khetheha bakeng sa indasteri ea FPC, boto ea potoloho, le CCM (Camera Compact Module), sistimi ena ea ho itšeha ka laser e kopanya bokhoni bo bongata: ho seha, ho cheka, ho slotting le ho kenya lifensetere. E sebetsana le mefuta e mengata e fapaneng ea lisebelisoa, ho kenyeletsoa liboto tse tenyetsehang, liboto tse thata, tse thata-liboto tsa flex, likoahelo, le{2}}li-layers tse ngata. Ka lebelo la eona le phahameng la ho itšeha, mochini o matlafatsa haholo katleho ea tlhahiso. E le mokhoa o phahameng-oa tharollo e phahameng-ea ho itšeha khafetsa, e fana ka litšenyehelo tse ikhethang-ka katleho le litšenyehelo tse tlase tsa ts'ebetso—e matlafatsang tlholisano ea khamphani haholo indastering.
Romela Inquiry

Shenzhen Chinasky Laser Technology Co., Ltd. ke e mong oa baetsi ba litsebi le barekisi ba mochini o sehang oa laser oa uv China. Ka kopo, kholiseha hore u tla reka mochini oa ho itšeha oa laser oa boleng bo holimo o nang le waranti ea lilemo tse 2 fekthering ea rona. Re boetse re amohela liodara tse ikhethileng.

 

Tšobotsi le Molemo

 

 Tšebelisano e Bophara ea Lintho

E sebetsana ka katleho le lisebelisoa tse thata ka li-laser tse ling, ho kenyeletsoa lipolasetiki, lirafshoa, likhalase, le litšepe tse bonahatsang haholo joalo ka koporo le aluminium.

 

 Mekhoa e tsoetseng pele ea Motion

-li-motor tse nepahetseng hantle le li-scanner tsa galvanometer li fana ka lebelo le ho nepahala ha litsela tse rarahaneng tsa ho seha.

 

Tekanyetso e Kopantsoeng ea Pono

Lik'hamera- tsa boemo bo holimo li iphumanela le ho hokahanya likheo ho ea ka matšoao kapa lipaterone, ho netefatsa bonnete ba PCB le likarolo tsa semiconductor.

 

Optimized Processing Libaka

E na le lisebelisoa tse ngata tsa 460 mm x 460 mm tse sebetsang ka laser bakeng sa liphanele tse kholo kapa lihlopha tse ngata, hammoho le sebaka sa ho sebetsa sa 50 mm x 50 mm -ka nepo. Bokhoni bona ba mefuta e 'meli- bo fana ka phetoho e ke keng ea lekanngoa, ho tloha ho ho sebetsa{7}}lisebelisoa tse kholo tsa sebopeho ho theohela ho ho etsa likaroloana tse rarahaneng haholo, tse nyenyane ka ho nepahala ho phahameng.

 

Database ea Ts'ebetso e Bohlale

Setsi sa polokelo ea litaba se felletseng se lumella bareki ho haha ​​​​le ho boloka lilaebrari tse ikhethang tsa ho itšeha bakeng sa sehlahisoa se seng le se seng. Sena se felisa liphoso tsa matsoho mme se netefatsa liphetho tse se nang sekoli, tse ka phetoang ho sa tsotelehe boiphihlelo ba opareitara.

 

High-Speed ​​Precision Motion System (XY-Axis)

E na le sethala{0}} sa tšebetso e phahameng se fanang ka lebelo le potlakileng la 800 mm/s le lebelo le holimo la 1G. Sena se netefatsa boemo bo potlakileng 'me se fokotsa haholo-nako ea ho se sebetse, e matlafatsang ts'ebetso ka kakaretso le katleho bakeng sa tlhahiso ea li-batch tse nyane le tse kholo.

 

Ts'ebetso e ntlafalitsoeng ea software

Sesebelisoa sa komporo se kenyelletsa mesebetsi e hlakileng joalo ka "Selective Cutting," "Tool{0}}Based Cutting," le "Material-Specific Parameter Presets." Sena se nolofatsa ho hlophisoa ha mosebetsi ka makhetlo a 'maloa, ho fokotsa nako ea koetliso le ho thibela liphoso.

 

Nalane ea Tlhahiso e Ikemetseng & Hopola

Sistimi e tlaleha ka bo eona data e felletseng ea sehlahisoa se seng le se seng. Ho fetola mesebetsi, basebelisi ba khetha feela lebitso la sehlahisoa lethathamong ho hopola hang-hang li-parameter tsohle, ho nolofalletsa liphetoho tse potlakileng le ho tlosa liphoso tsa ho seta bakeng sa lihlahisoa tse netefalitsoeng.

 

Advanced Operator Management & Audit Trail Fana

Batsamaisi ba nang le lisebelisoa tse matla tsa ho beha leihlo. Sistimi e ingolisa ka bo eona lits'ebetso tsohle tsa opareitara, ho kenyelletsa le linako tsa ho kena / ho tsoa, ​​phetoho e 'ngoe le e 'ngoe ea paramente e entsoeng, le nalane e felletseng ea lifaele tse sehiloeng tse sebelisitsoeng. Sena se tiisa ho lateloa ka botlalo le boikarabello le lithuso ho tlhahlobo ea taolo ea boleng.

 

Kopo

 

  • Semiconductor & Packaging ea IC:Wafer dicing (singulation), silicon seha, ceramic substrate seha, le ho lokisa liforeimi tse loto.
  • Flexible Electronics (FPC):Ho itšeha ka nepo le ho cheka ha Flexible Printed Circuits (FPC), likoahelo, le polyimide e tšesaane (PI) le PET layers.
  • Precision Engineering:Ho seha litšepe tse tšesaane (koporo, lifola tsa aluminium), ho theha micro-mechine ea motlakase (MEMS), le ho etsa meshes le lifilthara tse ntle.
  • Consumer Electronics:Ho khaola likhalase le safire bakeng sa li-module tsa khamera, li-sensor tsa ho ama, le likarolo tsa pontšo; ho tšoaea le ho fokotsa likarolo tsa smartphone.

 

LBH

P: Laser ea UV e khaola joang ka tsela e fapaneng le CO2 kapa laser fiber?

A: CO2 le fiber lasers li sebelisa mocheso ho qhibilihisa kapa ho etsa mouoane empa lebone la UV le sebelisa mokhoa o "batang" o bitsoang photo{1}}ablation. Bophahamo ba eona bo khuts'oane ba maqhubu le matla a phahameng a photon a senya maqhama a limolek'hule a thepa ka ho toba, a tlosa thepa hantle ka ho fetisetsa mocheso o fokolang sebakeng se potolohileng.

P: Ke lisebelisoa life tseo laser ea UV e ka li khaolang hantle?

A: Li-lasers tsa UV li ipabola ho seheng mefuta e mengata e fapaneng ea lintho tse bonojoana le tse thata, ho kenyelletsa:
● Plastics & Polymers: Polyimide (PI), PET, PEEK, PTFE, le lipolasetiki tse ling tsa boenjiniere.
● Litšepe tse Thin & Reflective: Lifole tsa koporo, tsa aluminiamo, tsa khauta le tsa silevera ntle le ho khantša libalaka.
● Ceramics: Alumina, zirconia, le lisebelisoa tse ling tsa substrate ntle le -mapetso.
● Glass & Sapphire: Bakeng sa likarolo tse hloekileng, tse laoloang le ho cheka ntle le ho pshatleha.
● Lisebelisoa tsa Semiconductor: Silicon, gallium arsenide, le li-semiconductors tse ling tse kopanetsoeng.

P: Mochini oa ho itšeha laser oa UV o nepahetse hakae?

A: Ho nepahala ha mochine oa ho itšeha laser oa UV ho phahame haholo. Sebaka se senyenyane ka ho fetisisa sa leseli se ka ba ka tlase ho 20 mm, 'me moeli o fokolang o monyenyane haholo. Mechini e ka fihlela boemo bo nepahetseng ba ± 3 um le ho pheta-pheta ho nepahala ha ± 1 um, ka mokhoa o nepahetseng oa ho sebetsa oa ± 20 um.

P: Melemo ea mantlha ea ts'ebetso ea "seha se batang" ke efe?

A: Melemo ea bohlokoa ke

  1. Ha ho Tšenyo ea Mocheso: E felisa ho chesa, ho qhibiliha, le mocheso-o bakoang ke ho senyeha.
  2. Superior Edge Quality: E hlahisa mabota a boreleli, a otlolohileng a se nang li-burrs kapa slag.
  3. HAZ e fokolang: E ​​sireletsa botšepehi ba lisebelisoa tse potolohileng sehiloeng.
  4. Bokhoni ba ho Fokotsa Mocheso-Lisebelisoa Tse Bohloko: E nolofalletsa ho sebetsa ha lisebelisoa tse ka senngoang ke li-laser tsa thermal.

P: Ke mofuta ofe o tloaelehileng oa botenya bakeng sa lisebelisoa tse sehiloeng ka laser ea UV?

K: Li-laser tsa UV li ntlafalitsoe bakeng sa-mosebetsi o nepahetseng ka ho fetesisa oa lisebelisoa tse tšesaane le tse bonojoana. Sebaka se loketseng hangata se tloha ho 1 micron ho ea ho 1-2 mm, ho itšetlehile ka thepa ea thepa. Ha lia etsetsoa ho seha lipoleiti tsa tšepe tse teteaneng kapa li-blocks.

P: Na sistimi ea laser ea UV e bolokehile hore e ka sebetsa?

A: Ho joalo. Laser e koaletsoe ka botlalo ka khabinete e koetsoeng ka polokeho, ho netefatsa hore ha ho mahlaseli a kotsi a UV a ka balehang nakong ea ts'ebetso. Basebelisi ba ka kenya le ho laolla likarolo ka mokhoa o sireletsehileng ntle le kotsi ea ho pepeseha.

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Tekheniki Parameters

 

Mohlala

HT{{0}UVC15

Matla a laser

15 W

Mofuta oa laser

UV Laser

Laser wavelength

355 nm

Sebaka se le seng sa Ts'ebetso

50 × 50 limilimithara

Total Processing Range

460 limilimithara × 460 limilimithara (O ka e etsa)

CCD{0}Ho Nepahallana

±3 μm

Auto{{0}Mosebetsi oa Maikutlo

Ee

XY-Ho Nepaha ha Maemo a Axis

±1 μm

XY-Ho Nepaha ha Boemo ba Axis

±3 μm

A tšehetsoa File Formats

DXF, DWG, GBR, CAD le tse ling